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Verified Project Evidence

Project Cases

Verified ceramic laser cutting deployments across South Korea, Taiwan, and China, delivering high-precision, stable processing for advanced ceramics, hard-brittle materials, semiconductor components, and electronic ceramic parts in mass production, R&D, and pilot-scale environments.

5+Casos verificados
3Países y regiones
5Sectores de aplicación
100%Entrega a tiempo

Historias de éxito de clientes

Filtre por industria, mercado o tipo de producto para encontrar una implementación comparable.

5 casos mostrados
Proyecto destacado · KRSouth Korean High-Precision Manufacturing Company
For ultra-precision cutting and micro-hole processing of high-end precision ceramic parts, special hard and brittle materials, and precision electronic components, adapting to the stringent precision, stability, and yield standards of the South Korean high-end manufacturing sector. KR Producto

South Korean High-Precision Manufacturing Company

The equipment fully meets the high precision and high stability requirements of overseas high-end manufacturing, achieving a finished product yield rate that meets international high-end standards; stable operation throughout the process, low maintenance costs, and adaptability to stringent overseas production conditions successfully verifying the equipment's export suitability and international quality, helping the brand to enter the South Korean high-end precision manufacturing market.

1 unit / Export of 1 high-configuration, high-precision laser cutting machine for use in high-end precision parts processing production linesCantidad
1.5+ years (stable operation overseas)Duración
——
TW
For simultaneous dual-station processing of high-precision ceramic sheets and micro-ceramic components, balancing efficient mass production with precision forming; supports independent/synchronous switching between dual beam paths to meet the needs of multi-process composite processing and flexible production of small batches and multiple product categories.Producto

High-end electronic component manufacturer in Taiwan

After the implementation of the dual-head, dual-beam path customized system, the equipment's processing capacity nearly doubled compared to a single-head machine. The processing accuracy at both stations was highly consistent, with no cumulative deviation. It perfectly met the client's flexible production needs for multiple product categories, high precision, and fast delivery times, significantly improving production line utilization and order fulfillment capabilities. The customized solution received high praise from the client.

1 unit / Customization of one dual-head, dual-beam path ceramic laser cutting machine to support a high-precision electronic component production lineQuantity
2+ years (stable operation in flexible mass production)Duration
2+ years (stable operation in flexible mass production)Ver caso →
CN
Used for mass cutting, dicing, and forming of ceramic substrates, ceramic insulating sheets, and precision ceramic structural parts for consumer electronics and automotive electronics, adapting to the factory's routine mass production and order batch delivery needs.Producto

High-tech Enterprise in China's Electronics

The equipment is suitable for long-term continuous mass production conditions, with a low failure rate and high stability, perfectly replacing traditional mechanical cutting processes; effectively reducing product chipping and breakage rates, significantly improving mass production efficiency and product consistency, helping customers achieve large-scale, standardized mass production of ceramic parts, effectively reducing production costs, and enhancing market delivery competitiveness.

7units / Batch deployment of multiple ceramic laser cutting machines to establish a standardized mass production line for ceramic substrates, achieving large-scale production.Quantity
4+ years (24/7 mass production operation)Duration
4+ years (24/7 mass production operation)Ver caso →
CN
Specialize in micro/nano cutting, precision drilling, and grooving of semiconductor ceramic substrates, ceramic packaging bases, and high-frequency ceramic components; these processes are used for semiconductor component R&D, sample preparation, and small-batch precision prototyping, meeting the high-cleanliness, high-precision, and zero-damage processing requirements of the semiconductor industry.Producto

National-level Semiconductor Materials Research Institute

The equipment enables cold processing of semiconductor ceramic materials, effectively avoiding thermal stress cracking and surface damage, and the processing tolerance is stably controlled at the micron level; it successfully meets the R&D and trial production needs of semiconductor precision components, greatly improving the R&D efficiency and sample yield of new semiconductor ceramic devices in the institute, and the equipment's precision and stability have reached the high-end standards of scientific research in the industry.

1 unit/A custom-designed semiconductor-specific ceramic laser cutting machine will be deployed to support the research institute's precision machining experimental production line.Quantity
2+ years (stable operation)Duration
2+ years (stable operation)Ver caso →
CN
This research focuses on the development of precision cutting, micro-hole drilling, and irregular dicing processes for advanced functional ceramics and novel structural ceramic materials. It undertakes university research projects, pilot-scale experiments for new materials, and industry-academia-research technology breakthroughs, providing process verification and data support for the industrial application of ceramic materials. It is well-suited for high-end laboratory research and成果转化 (technology transfer) scenarios.Producto

Top-tier research platforms in universities (Tsinghua University)

The equipment maintains high precision and low wear over a long period of time, perfectly matching the stringent processing standards of scientific research. It effectively solves industry problems such as easy chipping, thermal damage, and dimensional deviation in the laser processing of hard and brittle ceramic materials. It has helped the laboratory complete a number of new ceramic material technology breakthroughs and supported the implementation of several provincial and national scientific research projects. It has become the core main equipment of the laboratory's new material pilot and testing platform, fully verifying the equipment's scientific research-grade precision and long-term stability.

1 unit/Deploy a set of high-end precision ceramic laser cutting equipment, incorporate it into the laboratory's public testing and pilot-scale testing platform, and open up new material testing, process development, and sample prototyping services to theQuantity
3+ years (continuously and stably in service)Duration
3+ years (continuously and stably in service)Ver caso →
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