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Thermoelectric Separated Cu based PCB

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Detalles de producto
Type: Thermoelectric Separated Cu based PCB Model: Thermoelectric Separated Cu based PCB Params: Copper foil thickness: 35um Overall thickness: 1.6mm +/- 0.16 Panel size: 133.80*120.00mm/4ups Solder mask: White Silkscree color: Black Surface finished: OSP Material: Cu based Applicable Industry: Lighting Thermoelectrically separated double-sided copper-based substrate<p class=Thermoelectrically separated double-sided copper-based substrate