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22-Layer High Multilayer PCB – 64-Layer Capable, ±6% Single-Ended Impedance

en stock:
SKU: 3968623649
modelo: Various custom model names based on layers/materials/processes (e.g., 2L FR-4, Rigid-Flex, Rogers HF PCB, Ceramic PCB, etc.)

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22-Layer High Multilayer PCB – 64 Layers, ±6% Impedance | PCBMASTER

22-Layer High Multilayer PCB – 64-Layer Capable, ±6% Single-Ended Impedance

22-layer high multilayer PCB from PCBMASTER

Product Summary

PCBMASTER offers high multilayer PCBs with layer counts up to 64 layers. Our 22-layer boards feature precise impedance control: single-ended 50ohm ±6% and differential >50ohm ±7%. Layer registration tolerance is ≥4mil for boards over 12 layers, ensuring reliable high-speed signal integrity. Manufactured in our 80,000m² facility with 700 employees, we process over 3,000 orders daily with 99.6% first-pass yield.

Key Selling Points

  • Up to 64 Layers: Supports complex stack-ups for advanced telecom and server designs (source fact: layer count ≤64 layers).
  • Precise Impedance Control: Single-ended 50ohm ±6%, differential impedance >50ohm ±7% (source fact: differential impedance tolerance ±7%, single-ended ±6%).
  • Large Board Size: Max finished dimension 620x1092mm, accommodating large backplane and server boards (source fact: max finished dimension 620*1092mm).
  • High Registration Accuracy: Layer registration ≥4mil for >12 layers and ≥3mil for ≤12 layers (source fact: boards over 12 layers ≥4mil).

Technical Specifications

ParameterValue
Layer CountUp to 64 layers (22-layer standard)
Max Board Size620 x 1092 mm
Max Board Thickness4.2 mm
Single-Ended Impedance (50ohm)±6%
Differential Impedance (>50ohm)±7%
Layer Registration (>12 layers)≥4 mil
Pattern Accuracy (>500mm)±5 mil
Drilling Aspect Ratio (Through Hole)16:1
Min Back-Drill Diameter0.35 mm

Models and Options

Available models include custom stack-ups based on layer count, material (FR-4 TG155/180, Rogers, PTFE), and surface finish. Standard 22-layer build uses FR-4 TG180 with immersion gold. Contact us for specific configurations.

Materials and Structure

Standard materials: FR-4 TG155, FR-4 TG180. For high-speed designs, Rogers and PTFE laminates are available. Structure supports N+N stack-ups, hybrid lamination, and deep blind microvias.

Applications

Telecommunications: 5G base station backplanes, high-speed switches. Servers/Data Centers: High-density interconnect boards. Industrial Control: PLC and automation mainboards. Also used in medical imaging and automotive ECUs.

Customization

We offer custom layer stack-ups, impedance targets, surface finishes (ENIG, HASL, OSP), and special processes like back-drilling and via filling. No MOQ – prototypes from 1 piece to mass production.

FAQ

1. What is the lead time for 22-layer PCBs?

Standard lead time is 5-7 business days for prototypes, 10-15 days for volume orders. Expedited options available.

2. Can you provide impedance test reports?

Yes, we provide 100% flying probe testing with impedance measurement logs included.

3. Do you support UL certification?

Yes, our PCBs are UL 94V-0 certified. RoHS and REACH compliant.

4. What is the minimum order quantity?

No MOQ – we accept orders from 1 piece for prototypes.

5. How do you ensure layer registration accuracy?

We use LDI laser imaging and X-ray inspection to maintain ≥4 mil registration for >12 layer boards.

6. Can you ship globally?

Yes, we ship to 18+ countries via DHL/FedEx with DDP options.

7. What payment methods do you accept?

PayPal, credit card, bank transfer.

Inquiry Information

Email: service@pcbmaster.com | Tel: +86 190-6639-6428 | WhatsApp: +86 190-6639-6428

Image Filename and Alt Suggestions

Main image: 22-layer-high-multilayer-pcb-front-view.png (Alt: 22-layer high multilayer PCB front view).