Sobre nosotros WINTIME

WINTIME Semiconductor was established in 2020, integrating the research, development, production, and sales of high-precisionfer-level cutting blades. It provides customers with solutions for the entire process of high-precision cutting, helping to improve cutting quality and reduce production costs. It is recognized many leading enterprises at home and abroad as a supplier of high-precision cutting blades, cutting tapes, and cutting solutions. In 2023, nantong wintime Semiconductor Special Materials Project had a total investment of nearly tens of millions of yuan, with a new factory and auxiliary buildings of 34,00 square meters, and an annual production capacity of more than 1 million pieces of dicing blades, ranking in the forefront of the country. It has 2 patent technologies and has won many awards in national, provincial, and municipal science and technology competitions and entrepreneurship competitions. The company's completed "Ultra-thin Wafer D Blade" project has achieved a thickness of less than 9 microns in the process, and the product quality has reached the international cutting-edge level. It is of the few domestic companies that can achieve mass production. As a domestic self-developed project, we carry out the domestic substitution of high-end industries on the basis of advanced technology.
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Equipo de clase mundial
Graduados de universidades líderes a nivel mundial
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I+D avanzada
Desarrollado internamente
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Enfoque en innovación
Múltiples tecnologías innovadoras

Nuestros productos

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Sawing Blade

Sawing Blade

Modelo: SB-001
Parámetros: 0932490867

Dicing Blade

Dicing Blade

Modelo: DB-001
Parámetros: 1353562808

DZY Serie Ultra-Thin Wafer Dicing Blade ≤9μm para corte semiconductor

DZY Serie Ultra-Thin Wafer Dicing Blade ≤9μm para corte semiconductor

Modelo: DB-001
Parámetros: 4058107413

Serie JS Mancha de fijación de metales para escisión semiconductora

Serie JS Mancha de fijación de metales para escisión semiconductora

Modelo: DB-001
Parámetros: 9556171290

Hoja de corte de enlace de resina de la serie SZ para corte de obleas de baja tensión

Hoja de corte de enlace de resina de la serie SZ para corte de obleas de baja tensión

Modelo: DB-001
Parámetros: 9806757319

Galería de la empresa

WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Building
WINTIME Building

Casos de éxito

Semiconductor Packaging Factory

Semiconductor Packaging Factory

Cutting chipping rate ≤5μm, wafer yield increased by 12%, stable mass production without blade replacement
Ultra-thin thickness ≤9μm, narrow kerf, low material loss, long service life

Ubicación: CN 📦 Quantity: 500,000+ pieces annual usage, mass production line matching

Videos de la empresa y productos

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Introducción a la empresa y tour por la fábrica

⏱ Duration: 3:45 | 👁 Views: 15,230

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Demostración del producto - Kestrel K-1

⏱ Duration: 5:12 | 👁 Views: 28,450

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showcase de innovación tecnológica

⏱ Duration: 4:30 | 👁 Views: 12,890

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Testimonios de clientes y casos de éxito

⏱ Duration: 6:20 | 👁 Views: 9,650

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